Abstract: 2.5D packaging supports high-speed data transmission, meeting performance requirements of GPU. However, signal integrity (SI) is a key challenge to packaging. This paper demonstrates a GPU ...

Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

United States 2-Year Bond Yield Stay on top of current and historical data relating to U.S. 2-Year Bond Yield. By the definition, this two year term treasury note is intended as a way to fund U.S.

Strategy, World War II, Turn-based, For 2 Players, War Strategy, Indie Games, Alternative History, Multiplayer, Singleplayer, Hotseat The tenth expansion to the World War 2 turn-based strategy game ...